Clean Room Assembly of Semiconductor Tool Subsystems

Clean Room Assembly FMI’s long term commitment to state of the art assembly, integration and test facilities make us a leading supplier of subassemblies for semiconductor wafer processing equipment.  Rapid prototyping, assembly and testing of customer concepts facilitate an efficient design iteration process to respond to our customers “time to market” requirements. In house capability to design and fabricate tooling, assembly and test fixtures further enhances our ability to respond quickly to customer needs.

Assembly and testing procedures are defined and documented to assure consistent product configuration and performance. Testing capabilities include He Leak Check, Rate of Rise, Pressure Decay, Hydrostatic Pressure, Thermal Conductivity, Stress Strain, Functional and Dimensional inspection.

Please see the table below for additional details or contact us directly.

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Clean Room Assembly of Semiconductor Tool Subsystems Highlights

Product Description Semiconductor Process Chamber Sub-Module.
Capabilities Applied/Processes
Primary:
Assembly
Integration
Secondary:
Testing
Packaging
Equipment Used to Manufacture Part Custom Assembly Fixtures
Custom Test Fixtures
Benefits/ Features Facilities:
  • Class 10,000 Clean Room
  • Humidity Controlled Environment
  • Laminar Flow Benches (Class 1,000)
Assemblies:
  • Cathode Assemblies
  • Electrostatic Chuck (ESC)
  • Gas Distribution Showerheads
  • Lids
  • Dome Temperature Control Units
Parts:
  • Small benchtop assemblies
  • Medium size modules approximately 48” x 48” x 72”
Overall Part Dimensions Parts:
  • Range from small valves to 450mm components and sub-assemblies
Facilities 5,000 ft2
Tightest Tolerances 0.002mm in on diameters up to 450mm
Material Used Aluminum
Ceramics
Stainless Steel
In process testing/inspection performed Helium leak Test
Rate of Rise
Industry for Use Semiconductor Wafer Equipment Industry
Volume Single piece to full production volumes
Packaging Customer Specified, Mil Std and commercial
Delivery/Turnaround Time Rapid Prototyping in 1 to 2 weeks
Delivery Location Worldwide
Standards Met Customer provided print requirements, 2D Model standards.

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FM Industries, Inc.