Autoclave Bonding of Ceramic Electrostatic Chucks

Autoclave BondingFM Industries, Inc. is the leading supplier of electrostatic chuck and electrostatic chuck base plate components for the semiconductor industry. State of the art fabrication, bonding and test facilities are utilized in the manufacture of this critical semi-conductor product. A key portion of the manufacturing process is high pressure Autoclave bonding. Fully automated Autoclaves with data acquisition capability are used to perform this process in our Fremont California facility.

Thermally conductive, compliant sheet adhesives are cut into precise patterns and used to bond dissimilar materials together. The resulting bond layer provides stable thermal transfer between components, compliance to address CTE mismatch, resistance to chamber chemistry and high temperature performance.

Please see table below for details and contact us with any questions.

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Autoclave Bonding of Ceramic Electrostatic Chucks Highlights

Product Description Autoclave Bonded Electrostatic Chuck
Autoclave Bonding Capabilities Applied/Processes
Primary:
ESC Autoclave Bonding
Secondary:
Electrostatic base plating
Equipment Used to Manufacture Part
Autoclave
Vacuum oven
Cleanroom oven
Cutter/ Plotter
Benefits/ Features Adhesive Types:
  • Pressure Sensitive adhesives
  • Thermal conductive adhesives
  • RTV's
  • Epoxies
  • Primers
Overall Part Dimensions O.D.: 19” Dia. X 4” thick
Temperature Range up to 130°C
Tightest Tolerances 0.002" on diameters up to 450mm
Material Used
Aluminum
Pressure Sensitive Adhesives
Ceramics
Material Finish 16 RMS
In process testing/inspection performed
Data Logs
Dimensional
Bond Layer
Industry for Use Semiconductor Industry
Volume Single piece to full production quantities
Packaging Customer specifications/ Mil-Std/Custom designed
Delivery/Turnaround Time Delivery Time: 2-3 Weeks
Delivery Location Worldwide
Standards Met Customer provided print requirements, 3D Model standards.

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FM Industries, Inc.