Autoclave Bonding of Ceramic Electrostatic Chucks
FM Industries, Inc. is the leading supplier of electrostatic chuck and electrostatic chuck base plate components for the semiconductor industry. State of the art fabrication, bonding and test facilities are utilized in the manufacture of this critical semi-conductor product. A key portion of the manufacturing process is high pressure Autoclave bonding. Fully automated Autoclaves with data acquisition capability are used to perform this process in our Fremont California facility.
Thermally conductive, compliant sheet adhesives are cut into precise patterns and used to bond dissimilar materials together. The resulting bond layer provides stable thermal transfer between components, compliance to address CTE mismatch, resistance to chamber chemistry and high temperature performance.
Please see table below for details and contact us with any questions.
Autoclave Bonding of Ceramic Electrostatic Chucks Highlights
||Autoclave Bonded Electrostatic Chuck|
|Autoclave Bonding Capabilities Applied/Processes
ESC Autoclave Bonding
Electrostatic base plating
|Equipment Used to Manufacture Part
- Pressure Sensitive adhesives
- Thermal conductive adhesives
|Overall Part Dimensions
||O.D.: 19 Dia. X 4 thick|
||up to 130°C |
||0.002" on diameters up to 450mm|
Pressure Sensitive Adhesives
|In process testing/inspection performed
|Industry for Use
||Single piece to full production quantities|
||Customer specifications/ Mil-Std/Custom designed|
||Delivery Time: 2-3 Weeks |
||Customer provided print requirements, 3D Model standards.|
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